Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10

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Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
6/5-2013 1/4 1/4 6" ELK stitching 11/1-2013 CB on oxide carrier standard stepper mask (50 nm barc + 320 nm krf) Si / 50%+ Pegasus / jmli 3min TDESC clean + 30 sec barc etch polySOI5 , 50 cycles or 6:15 minutes S003472

16/7-2013 1/4 6" ELK stitching 11/1-2013 CB on oxide carrier standard stepper mask (50 nm barc + 320 nm krf) Si / 50%+ Pegasus/jmli 3 minute TDESC clean + 30 second barc etch jml/SOI3/polySOI-10: 50 cycles or 6:15 minutes S003614 lsh: c4f8 etch -> 20

23/8-2013 1/4 6" tigre 400 nm pitch pattern CB on oxide carrier standard stepper mask (50 nm barc + 320 nm krf) Si / 50 % in 20*20 mm squares Pegasus / jmli 10 minute TDESC clean + 30 second barc etch jml/SOI3/polySOI-10: 100 cycles or 12:30 minutes S003695

15/5-2014 6" DUV Lithography test pattern standard stepper mask (50 nm barc + 320 nm krf) Si / 50 % in 20*20 mm squares Pegasus / jmli 10 minute TDESC clean + 30 second barc etch jml/SOI3/polySOI-10: 50 cycles or 6:15 minutes + 2 mins gentle PR strip S004031

28/8-2014 6" DUVboxA wafer standard stepper mask (50 nm barc + 320 nm krf) Si / 50%+ Pegasus / jmli 30 sec barc etch SOI4\polySOI-10 , 70 cycles or 8:45 minutes S004289

28/8-2014 6" DUVboxB wafer Si/200nm Oxide/1800 nm poly / standard stepper mask (50 nm barc + 320 nm krf) poly / 50%+ Pegasus / jmli 75 sec barc etch SOI4\polySOI-10 , 20 cycles or 2:30 minutes S004289

28/8-2014 6" DUVboxB wafer Si/200nm Oxide/1800 nm poly / standard stepper mask (50 nm barc + 320 nm krf) poly / 50%+ Pegasus / jmli 0 sec barc etch SOI4\polySOI-10 , 30 + 10 cycles or 5:00 minutes S004291 (two processes) S004289 reprocessed, probably overetched -> no spikes