Specific Process Knowledge/Back-end processing/Wire Bonder

TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT HB 100 wire bonder: process details

TPT HB100 Wire Bonder

Ball Wire Bonder K&S 4524

K&S 4524 ball wire bonder

The bonder is currently in building 346 Phoenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond

Equipment	TPT HB100 Wire Bonder	Ball Wire Bonder K&S 4524
Purpose	Al and Au 25µm wire bonding Wedge and ball wire bonding Au ribbon (100x20µm) bonding	Au 25µm wire bonding Ball wire bonding
Performance	Manual operation Wedge bonding: recommended min. bonding area 200 µm x 200 µm Ball bonding: recommended min. bonding area 200 µm x 200 µm recommended temperature 120 oC.	Semi-automatic and manual operation Bond placement laser pointer recommended min. bonding area 100 µm x 100 µm recommended temperature 120 oC.
Substrates	Should be able to withstand the wire bonding temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)