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The Polisher/Lapper has been decomissioned end of 2024.
Polisher/Lapper
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
Equipment performance and process related parameters
PM5 lapper in Fume hood
| Equipment
|
Polisher/Lapper
|
| Purpose
|
Thinning of substrates of
|
- InP
- GaAs
- Silicon
- Metals
- Glass/Quartz
|
| Performance
|
Thinning
|
- Removal rate: 1-10µm/min
- Thickness accuracy: +/- 10 µm
- Thickness homogeneity: +/- 10 µm
- Roughness: +/- ? µm
|
| Polishing
|
- Removal rate: ~1 µm/min
- Thickness accuracy: ? µm
- Thickness homogeneity: ? µm
- Roughness: +/- ? µm
|
| Process parameter range
|
Polishing liquid
|
- Al2O3 (alumina) powder: 3, 9 or 20 µm
- Chemlox (for polishing)
- SF1 Polishing Fluid (for polishing e.g. SiO2)
|
| Polishing cloths
|
- Chemcloth Polishing Cloths (for use with SF1 liquid)
|
| Rotation speed
|
- Thinning: 5-20 rpm
- Polishing: 5-80 rpm
|
| Arm sweep
|
- Thinning: stationary
- Polishing: 12% (inner) - 80% (outer)
|
| Substrates
|
Batch size
|
- # small samples
- one 50 mm wafer
- one 100 mm wafer
|
| Allowed materials
|
- InP
- GaAs
- Silicon
- Metals
- Glass/Quartz
|
lapping jig
mounting/measuring space
