File:Square silica on 200 mm wafer comp.JPG

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Square_silica_on_200_mm_wafer_comp.JPG ‎(448 × 278 pixels, file size: 15 KB, MIME type: image/jpeg)

This is a photograph of a trial substrate bonded to a 200 mm round wafer using CrystalBond.

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	14:45, 25 November 2009		448 × 278 (15 KB)	Ajoe (talk \| contribs)	This is a photograph of a trial substrate bonded to a 200 mm round wafer using CrystalBond.

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Camera manufacturer	SONY
Camera model	DSC-W70
Exposure time	1/40 sec (0.025)
F Number	f/2.8
ISO speed rating	125
Date and time of data generation	12:09, 5 August 2009
Lens focal length	6.3 mm
File change date and time	12:09, 5 August 2009
Y and C positioning	Co-sited
Exposure Program	Normal program
Exif version	2.21
Date and time of digitizing	12:09, 5 August 2009
Image compression mode	8
APEX exposure bias	0
Maximum land aperture	3 APEX (f/2.83)
Metering mode	Pattern
Light source	Unknown
Flash	Flash did not fire, auto mode
Color space	sRGB
Custom image processing	Normal process
Exposure mode	Auto exposure
White balance	Auto white balance
Scene capture type	Standard
Contrast	Normal
Saturation	Normal
Sharpness	Normal