File:Air bubble.jpg
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While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. Consequently some areas on the wafer were not deposited with copper.
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Date/Time | Thumbnail | Dimensions | User | Comment | |
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current | 10:19, 26 June 2015 | 861 × 661 (154 KB) | Lynhen (talk | contribs) | While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. |
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