File:Air bubble.jpg

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While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. Consequently some areas on the wafer were not deposited with copper.

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current10:19, 26 June 2015Thumbnail for version as of 10:19, 26 June 2015861 × 661 (154 KB)Lynhen (talk | contribs)While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.

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