File:3 longbond AltoAu 1to2 8microdistance Auto test3 2outof3Autosucess.png
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Automatic recipe with different bond lengths and constant loop height, the bonding plan describes the direction of bond eg. package to chip; chip1 to chip2. The bonding length describes how much of loop height is required.
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 16:49, 27 August 2025 | | 1,920 × 1,080 (879 KB) | Prakus (talk | contribs) |
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