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• 14:17, 7 April 2011 Jml talk contribs uploaded File:WF 2E02 mar23 2011-060.jpg (The profiles of the 211 nm thick zep resist wafers (The E-batch of march 23 2011). The wafers have been over-exposed in the E-beam (400 µC/cm2) to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wide)