Specific Process Knowledge/Back-end processing/Polymer Injection Molder
THIS PAGE IS UNDER CONSTRUCTION
Feedback to this page: click here
Polymer injection molding
The injection molder at Danchip is an Engel Victory Tech 80/45. It is hydraulic machine capable of up to 450 kN of clamping force.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Polymer injection molding Info on LabManager
Process information
| Parameter | Value | |
|---|---|---|
| Sample dimensions | Diameter |
50, 100 or 150 mm (~ 2", 4" or 6") |
| Sample thickness |
Maximum 1,0 mm | |
| Process parameters | Temperature |
52*C |
| pH |
3,5 - 3,8 | |
| Sample requirements | Seed metal |
100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter-System(Lesker). |
| Allowed materials |
Most materials allowed. See below. | |
| Forbidden materials |
Copper, cobalt. See machine manual on LabManager for details | |