Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.

Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose		Particles counting
Performance	Particles size	0.1 µm to 3 µm
	Througput	Up to 100 wafer per hour (200 mm)
	Repeatbility	Within 1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
Process parameter range	Process Temperature	Room temperature
	Process pressure	1 atm
Substrates	Batch size	Small wafer pieces can all be used 1-25 100 mm wafers 1-25 150 mm wafers 1-25 200 mm wafers
	Substrate material allowed