Specific Process Knowledge/Thin film deposition/Deposition of Gold

4th Level - Comparison

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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	Sputter (Lesker)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	up to 1x6" wafer
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10 Å to 5000Å	10 Å to 5000Å	10 Å to
Deposition rate	2 Å/s to 15 Å/s	1 Å/s to 15 Å/s

Adhesion of Au on Si

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings