Specific Process Knowledge/Thin film deposition/Deposition of Silicon

PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace.

Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	Sputter (Alcatel)	Furnace PolySi
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers
Pre-clean	RF Ar clean	Ar ion bombartment
Layer thickness	10Å to 1µm	10Å to 1500Å
Deposition rate	2Å/s to 15Å/s	1Å/s to 5Å/s

Sputtered Silicon in the Alcatel

The parameter(s) changed	New value(s)	Deposition rate
Standard parameters	None
Power	400W	3.8 Å/s