Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation

Parameters

	In the image the following parameters are shown: Top Width (TW) Depth (D) Bottom Width (BW) Mid Width (MW) To speed up the characterisation post-SEM the parameter 'Pixel Size' (PS) is added to the SEM databar (the blue circle).
	Depth	D*PS
	Bowing	$2{\frac {MW-{\frac {TW+BW}{2}}}{(TW+BW)}}$
	Sidewall angle	$acos({\frac {TW-BW}{2{\sqrt {D^{2}+{\frac {1}{4}}(TW^{2}-BW^{2})}}}})$