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Comparing Lithography methodes at Danchip

There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.

Process description using methode 1

Process description using methode 2

Comparison methode 1 and methode 2 for the process

	Photolithography	DUV Lithography	E-beam Lithography	Imprint Lithography	Two photon polymerization Lithography
Generel description	Generel description - methode 1	Generel description - methode 2	3	4	5
Pattern size range	~1µm and up	~200nm and up	~10nm and up	~20nm and up	3D ?nm
Resist type	UV sensitive: AZ SU8	DUV sensitive fff	E-beam sensitive ZEP502A SU8	Imprint polymers: ??	?? sensitive: ??
Resist thickness range	~0.5µm to 20µm?	~50nm to 2µm?	~20nm to 1µm?	~20nm to 10µm?	?nm - ?µm
Typical exposure time	2s-30s pr. wafer	?-? pr. ?	?-? pr. µm2	? pr. wafer	? pr. µm2
Substrate size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3	Allowed material 1 Allowed material 2 Allowed material 3	Allowed material 1 Allowed material 2 Allowed material 3	Allowed material 1 Allowed material 2 Allowed material 3