Specific Process Knowledge/Etch/ICP Metal Etcher/Titanium
Titanium etch
Parameter | Process 1 | Process 2 |
---|---|---|
Cl2 (sccm) | 30 | 30 |
HBr (sccm) | - | - |
Pressure (mTorr) | 3, Strike 3 secs @ 15 mTorr??? | 3 |
Coil power (W) | 800 | 900 |
Platen power (W) | 100 | 50 |
Temperature (oC) | 20 | 20 |
Spacers (mm) | 30 | 30 |
Etch rate (nm/min) | 152 | 64 |
AZ resist selectivity | 0.67 | 0.83 |