Specific Process Knowledge/Thermal Process/Jipelec RTP

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Jipelec - Rapid Thermal Processing

Jipelec RTP: Positioned in cleanroom 1

The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier).


Purpose RTP annealing
Performance
Process parameter range Process Temperature
  • 0-1000 oC
  • High temperature ramp >300 oC
Process pressure
  • 1 atm
  • vacuum
Gasses on the system
  • N2
Substrates Batch size
  • 1 4" wafer (or 2" wafers) per run
  • Small samples
Substrate material allowed
  • Silicon
  • Silicon oxides
  • Silicon nitrides
  • Quartz
  • Polysilicon
  • Titan
  • III-V materials (on graphite carrier)
  • Silicon wafers (new from the box or RCA cleaned)
  • In doubt: look at the cross contamination chart or send a mail to the Furnace group.
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