Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes
Overview of the standard processes: Processes A, B, C, D and SOI
The instrument was accepted on the basis of the performance of 5 processes. Below is a general comparison - to find more detailed information, go the web page for each process
| Process name | Type | Purpose | Conditions during original runs | Best usage | |||
|---|---|---|---|---|---|---|---|
| Feature | Mask material | Etch load | Comments | ||||
| Process A | Bosch | Fast etch | 80 µm trench | Photo resist | 12-13 % on 6" wafer | ||
| Process B | Bosch | Fast etch | 30 µm diameter via | Photo resist | 12-13 % on 6" wafer | ||