Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes

Overview of the standard processes: Processes A, B, C, D and SOI

The instrument was accepted on the basis of the performance of 5 processes. Below is a general comparison - to find more detailed information, go the web page for each process

Standard processes on the DRIE-Pegasus

Process name	Type	Purpose	Conditions during original runs				Best usage
			Feature	Mask material	Etch load	Comments
Process A	Bosch	Fast etch	80 µm trench	Photo resist	12-13 % on 6" wafer
Process B	Bosch	Fast etch	30 µm diameter via	Photo resist	12-13 % on 6" wafer