Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec

Silicon sputter

Silicon can be deposited in Wordentec.

Parameters

Listed below are tried parameters, that can be used during deposition.

Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces.

	Setting
Process type	Sputtering
Power	1000W
Base pressure	6*10-7
Ignition pressure	6*10-3
Sputter pressure	4*10-3
Rate	About 0,14Å/s (2 wafers plates, rotating)