Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec

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Silicon sputter

Silicon can be deposited in Wordentec.


Parameters

Listed below are tried parameters, that can be used during deposition.


Setting
Process type Sputtering
Power 1000W
Base pressure 6*10-7
Ignition pressure 6*10-3
Sputter pressure 4*10-3
Rate About 0,14Å/s (2 wafers plates, rotating)
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