Specific Process Knowledge/Etch/Etching of Silicon Nitride
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Revision as of 11:42, 15 November 2007 by Fj (talk | contribs) (→Comparison of wet Silicon Nitride etch and RIE etch for etching of Silicon Nitride)
Silicon nitride can be etched using either wet chemistry or dry etch equipment. Wet chemistry is mainly used to remove all the nitride on the surface (backside and frontside) of a wafer. Dry etching etches one side at a time and can be used to etch structures with several masking materials.
Comparison of wet Silicon Nitride etch and RIE etch for etching of Silicon Nitride
Wet Silicon Nitride etch | RIE | |
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What is it good for: |
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Possible masking materials: | ? |
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Etch rate |
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Process volume |
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Size of substrate |
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