Specific Process Knowledge/Thin film deposition/Deposition of Platinum

Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers
Pre-clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 1 µm
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s