Specific Process Knowledge/Back-end processing/Wire Bonder/new page name
Feedback to this page: click here
THIS PAGE IS UNDER CONSTRUCTION
| Bonding Specifications | Bonding Methods | Wedge–Wedge, Ball–Wedge, Ribbon, Bump |
|---|---|---|
| Bond Head Capability | One head for Wedge & Ball bonding (tool change only) | |
| Wire Diameter (Gold) | 12–75 µm (0.5–3 mil) | |
| Wire Diameter (Aluminium) | 17–75 µm (0.7–3 mil) | |
| Wire & Ribbon Handling | Ribbon Size | Max. 25 × 250 µm (1 × 10 mil) |
| Wire Spool Size | 2" diameter | |
| Wire Feed Angle / Immersion Depth | 90° deep access / 14 mm immersion | |
| Ultrasonic & Bonding Parameters | Ultrasonic Frequency | 63.3 kHz PLL control (110 kHz option) |
| Ultrasonic Power | 0–10 W | |
| Bond Time | 0–5 seconds | |
| Bond Force | 10–200 cN | |
| Bonding Tool Size | 1.58 mm Ø × 19 mm length (0.0624" × 0.750") | |
| Wire Termination | Bond Head Tear or Clamp Tear | |
| Mechanics & Motion Control | Z-Drive / Resolution | Lead screw motor / 0.5 µm |
| Motorized Z Travel | 100 mm (3.9") | |
| X–Y Drive / Resolution | Linear motors / 0.1 µm | |
| Motorized X–Y Travel | 100 mm (3.9") | |
| Max. Component Width | 400 mm (15.7") | |
| Rotation Drive Accuracy | ±0.5° | |
| Control & Interface | Axis Control | Joystick |
| Screen Size | 21" touchscreen | |
| Software Environment | Industrial PC with Windows | |
| Camera & Optics | Camera System | Dual camera (detail + overview) |
| Magnification | Up to 150× | |
| View Mode | Simultaneous detail & overview | |
| Heater Stage | Size | 90 mm Ø surface (mechanical & vacuum clamping) |
| Temperature Range | Up to 200 °C ±1 °C | |
| Clamping | Mechanical & vacuum |
For detailed information on compatible wires and bonding tools for the HB100, visit the TPT Wires & Tools page.
The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person. The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.
HB100 Bonding Parameters – 25 µm Gold Wire
| First Bond | Ultrasonic Power (US) | 150-200 |
|---|---|---|
| Bond Time | 80-200 | |
| Bond Force | 250-450 | |
| Second Bond | Ultrasonic Power (US) | 150-200 |
| Bond Time | 80-200 | |
| Bond Force | 300-400 | |
| Wire | Wire Diameter | 25 µm (Gold) |
| Wire Detect | First Bond: 20 / Second Bond: 0 | |
| Loop | Loop Height | 500(short length bonds)-5000 (long length bonds) |
| Tail Mode (Clamp Feed Length) | 350-500 | |
| Temperature | ||
| Stage | 0-120 (No need of temp when high US(>300)) | |
| Bond Positions | First Bond (X1, Y1) | Teach first bond to register coordinates |
| Second Bond (X2, Y2) | Teach second bond to register coordinates | |
| Bond directions | ||
| Package (P) & chip (1) | P>P
1>1 P>1 1>P |
Automatic process
When creating a new recipe, the bonding plan must be defined at the startup. While setting up a new wire, specify the first and second bond locations, this will automatically register the bonding plan (visible in the Bonding Plan screen).
The number of wires created will correspond to the number of bonds required. After registering the wires, check the bond direction under the Wire and Chips columns. These directions may appear as P>P, 1>P, or 1>2. Adjust them as needed to match your bonding requirements.
To perform multiple bonds in sequence, select Continue Package. This will make multiple bonds and ensure the ball is created after each bond process.
- For more details contact thcl@dtu.dk or prakus@dtu.dk