Specific Process Knowledge/Back-end processing/Wire Bonder/new page name
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TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire. The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.
| Bonding Specifications | Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon |
|---|---|---|
| Wire Diameter (Gold) | 12–75 µm | |
| Wire Diameter (Aluminium) | 17–75 µm | |
| Ribbon Size | Up to 25 × 250 µm | |
| Ultrasonic Frequency | 63.3 kHz (110 kHz option) | |
| Bond Force | 10–200 cN | |
| Motion & Control | X-Y Travel / Resolution | 100 mm / 0.1 µm |
| Z Travel / Resolution | 100 mm / 0.5 µm | |
| Rotation Accuracy | ±0.5° |