Specific Process Knowledge/Etch/ICP Metal Etcher

From LabAdviser

The ICP Metal Etcher in short

Despite its name the metal etcher doesn't etch metals in general. Currently, the list of metals that you can etch is quite short:

  • aluminium
  • titanium
  • chromium

Over time it is our intention to add other materials to the list (such as molybdenum, tungsten, titaniumtungsten, titaniumoxides or piezo-materials such as ZnO) but currently the list

Etching of nanostructures in silicon using the ICP Metal Etcher or DRIE Pegasus


Recipe Sinano 3.0 3.1 3.2 3.3 3.4 4.0 3.5 3.6 3.3 3.7 3.31 3.31 3.32
Cl2 (sccm) 0 0 0 0 0 20 15 15 0 0 0 0 0
BCl3 (sccm) 5 3 5 5 5 0 5 5 5 5 5 5 5
HBr (sccm) 15 17 15 15 15 0 0 0 15 15 15 15 15
Coil power (W) 900 L 900 F 900 F 900 F 900 F 900 L 900 L 900 F 900 F 900 L 900 F 900 F 900 F
Platen power (W) 50 50 60 75 90 60 60 60 75 60 75 75 30
Pressure (mtorr) 2 2 2 2 2 2 5 10 2 10 2 2 2
Temperature (oC) 20 20 20 20 20 20 20 20 20 50 50 50 50
Spacers (mm) 100 100 100 100 100 100 100 100 100 100 100 30 100
Process time (s) 150 180 120 180 120 90 120 180 300 180 180 180 180
Etch rates (nm/min)
Averages 311 104 92 105 116 169 108 79 101 66 91 98 59
Std. Dev 44 15 15 21 22 9 11 31 29 4 28 18 12
Zep etch rate (nm/min)
30 40 51 67 45 59 53 36 19
Sidewall angle (degrees)
Averages 82 82 82 82 82 84 81 83 83 85 80 83 79
Std. Dev 2 2 1 1 1 1 1 2 2 1 3 2 2
CD loss (nm pr edge)
Averages 65 -11 -15 -2 -11 67 63 -29 -5 -29 10 -14 -17
Std. Dev 30 5 2 4 3 29 27 6 5 8 7 8 10
Bowing (nm)
Averages 31 31 15 6 5 22 12 15 28 13 25 1 -2
Std. Dev 6 7 3 6 4 5 2 6 9 7 5 2 2
Botton curvature
Averages -9 -6 -9 -11 -9 9 -4 -8 -24 -2 -9 -13 -10
Std. Dev 22 19 19 11 7 17 15 15 12 15 13 17 18


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