Specific Process Knowledge/Thermal Process/Annealing

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Annealing

At DTU Nanolab we have five furnaces and two RTP (rapid thermal processor) that can be used for annealing: Anneal-Oxide furnace (C1), Anneal-bond furnace (C3), Al_anneal furnace (C4), Multipurpose Anneal furnace, RTP2 Jipelec and RTP Annealsys (last one, reserved to research). Annealing normally takes place in an N2 atmosphere, or it can be done in H2 or a H2-N2 gas mixture in the Multipurpose Anneal furnace. PECVD PBSG glass is annealed in a wet atmosphere which will also oxidize the silicon substrate.

A 20-minute N2 annealing step is also included in all recipes on the oxidation furnace, this annealing is done after the oxidation.

Comparison of the annealing furnaces

Anneal Oxide furnace (C1)

Anneal-Bond furnace (C3)

Aluminium Anneal furnace (C4)

Multipurpose Anneal Furnace

RTP2 Jipelec

RTP Annealsys (research tool)

General description Annealing of 4" and 6" wafers. Annealing of wafers from the LPCVD furnaces and from PECVD4. Annealing of wafers from Wafer Bonder 02 and from and PECVD4 and PECVD3. Annealing of wafers with Al and ALD deposited AL2O3 and TiO2. Annealing, oxidation and resist pyrolysis of different samples. Rapid thermal processing, usually, annealing (RTA). Rapid thermal processing: RTA (annealing), RTO (oxidation), RTN (nitridation) and RTH (hydrogenation).
Annealing gas
  • N2
  • N2
  • N2
  • N2
  • H2
  • H2-N2 gas mixture
  • Vacuum is possible
  • Ar
  • N2
  • Low vacuum is possible (min. 2/3 mbar)
  • Ar
  • NH3
  • O2
  • 5% H2/Ar
  • High vacuum is possible (10-6 mbar)
Process temperature
  • 700 oC - 1100 oC
  • 700 oC - 1150 oC
  • Up to 500 oC
  • Vacuum: 20 oC - 1050 o
  • No vacuum: 20 oC - 1100 oC
  • 20 oC - 1200 oC
  • Max. 100 oC/s with carrier wafer or sample wafer
  • Max. 50 oC/s with SiC-coated graphite susceptor
  • 700 oC - 1200 oC
Substrate and Batch size
  • Small samples on a carrier wafer, horizontal
  • 1-30 50 mm wafers
  • 1-30 100 mm wafers
  • 1-30 150 mm wafers
  • Small samples on a carrier wafer, horizontal
  • 1-30 50 mm wafers
  • 1-30 100 mm wafers
  • 1-30 50 mm wafers
  • 1-30 100 mm wafers
  • 1-30 50 mm, 100 mm or 150 mm wafers
  • 1-50 200 mm wafers
  • Small samples on a carrier wafer, horizontal
  • Single-wafer process
  • Chips on carrier
  • 50 mm, 100 mm or 150 mm wafers
  • Single-wafer process
  • Chips on carrier
  • 100 mm or 150 mm wafers
Allowed materials
  • All processed wafers have to be RCA cleaned, except wafers from LPCVD furnaces and PECVD4.
  • All processed wafers have to be RCA cleaned, except wafers from the Wafer Bonder 02 and from PECVD4 and PECVD3.
  • Wafers with Al
  • Depends on the furnace quartz ware:
    • Clean: Samples that have been RCA cleaned
    • Metal: Almost all materials, permission is needed
    • Resist (for pyrolysis)
  • Silicon
  • Silicon oxides and nitrides
  • Quartz
  • Metals - ask for permisson
  • III-V materials - below 440 °C, otherwise it can lead to outgassing of toxic gases.
  • Silicon
  • Silicon Nitride
  • Aluminum Oxide