File:WF 2B1 feb06 2011-060.jpg

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Revision as of 08:52, 16 March 2011 by Jml (talk | contribs) (The profiles of the 180 nm thick zep resist wafers. The wafers have been over-exposed in the E-beam to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wider.)
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The profiles of the 180 nm thick zep resist wafers. The wafers have been over-exposed in the E-beam to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wider.

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current08:52, 16 March 2011Thumbnail for version as of 08:52, 16 March 20111,024 × 768 (56 KB)Jml (talk | contribs)The profiles of the 180 nm thick zep resist wafers. The wafers have been over-exposed in the E-beam to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wider.

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