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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/EM with resist mask

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< Specific Process Knowledge‎ | Etch‎ | DRIE-Pegasus‎ | Pegasus-4‎ | SiO2 Etch

Revision as of 08:36, 11 September 2023 by Bghe (talk | contribs) (→‎Looking at bit on the effect of using electromagnets for etching SiO2 with DUV resist)

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Looking at bit on the effect of using electromagnets for etching SiO2 with DUV resist

Unless otherwise stated, all content in this section was done by Berit Herstrøm, DTU Nanolab

Removing the H2 from the recipe to get less redeposition @ 200W platen power, EM:02/30A

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