Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Sputter rates for Al

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Text by DTU Nanolab staff

Deposition rate of Al sputtering in the Wordentec

Deposition rate, film uniformity and grain size of Al depends on the process parameters (mainly on power and pressure) during the sputtering process.

From the experiment which set Pressure 10^-3 mbar, Power 150 W

The deposition rate in the Wordentec is established to be 1.6 Å/s (in the center of the wafer, 1.4 Å/s at the edge).

Measured October 2008, KNIL, DTU Danchip (now DTU Nanolab).