Specific Process Knowledge/Etch/ICP Metal Etcher/Examples of End point detection

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Cr etch with end point on SiO2

Done April 2023 by bghe

The above images shows a view from Spectral View during etching Cr with DUV resist as masking material of a 6" wafer with more than to 50% open area. The standard Cr etch was used. The endpoint was most clearly seen with the parameters:

  • Cr5208av (Average A for region Cr_5208)
  • Cr_Avg_5208
  • normClOverCr (ScalePct(CrOVerCl, 10,20,100)
  • smCr over Cl (Avg2(normCrOverCl, 50)
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