File:BGE Glass etch Cr50Au400n1 03.jpg

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Revision as of 09:08, 3 December 2010 by BGE (talk | contribs) (15min HF 40% etch of borofloat with 50/400 nm Cr/Au mask made in the Alcatel E-beam evaporator. Resist for masking the Cr/Au etch has been left on and baked at 120 degrees of ½ hour. The image is taken a random place on the wafer.)
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15min HF 40% etch of borofloat with 50/400 nm Cr/Au mask made in the Alcatel E-beam evaporator. Resist for masking the Cr/Au etch has been left on and baked at 120 degrees of ½ hour. The image is taken a random place on the wafer.

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current09:08, 3 December 2010Thumbnail for version as of 09:08, 3 December 20102,560 × 1,920 (211 KB)BGE (talk | contribs)15min HF 40% etch of borofloat with 50/400 nm Cr/Au mask made in the Alcatel E-beam evaporator. Resist for masking the Cr/Au etch has been left on and baked at 120 degrees of ½ hour. The image is taken a random place on the wafer.

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