Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)/BHF etch rates

Etch rate in	BHF	5% HF	30% HF	40% HF	BHF with wetting agent
Wet Thermal Oxide [nm/min]	78.191 / 794	24.891	282.851		794
Pyrex [nm/min]	35			3000
TEOS [nm/min]	265	153
PECVD3 (LFSiO) Oxide [nm/min]	2253
PECVD3 (MFSiNLS2) Nitride [nm/min]					595
PECVD4 (Waveguide) Oxide [nm/min]				1300-14006	1055 / 1086
PECVD4 (HF SiO2) Oxide [nm/min]					2305 / 248±256
Silicon Rich Nitride [nm/min]	0.331	0.601	2.61
Stochiometric Nitride Si3N4 [nm/min]	0.752