Specific Process Knowledge/Characterization/SEM LEO

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The SEM LEO has been decommissioned and relocated to DTU Mechanics

The SEM LEO located in cleanroom F-2

The SEM LEO was a very reliable and rugged instrument that provided high quality SEM images of most samples and it served the users of the cleanroom for many years. Excellent images on a large variety of materials such as semiconductors, semiconductor oxides or nitrides, metals, thin films and some polymers were acquired by the thousands on the SEM.

In her later years the SEM LEO was equipped with a Raith e-beam lithography system and was exclusively dedicated to the users of the Raith E-beam lithography. Decommissioned in early summer 2020, she is at DTU Mechanics.

The user manual, control instruction and the user APV can still be found in LabManager:

SEM LEO info page in LabManager,


Performance information

Typical current values for EBL

Reported values are the average of five measurements from Elphy Quantum using the EBL holder's Faraday cup. All values in pA.

LEO - Current measurements 11/02/2017
  5kV 10kV 15kV 20kV
10um 13 17 20.5 25
20um 62 87 105 127
30um 160 175 215 264
60um 510 680 850 1040

Equipment performance

Equipment SEM LEO (Leo 1550 SEM)
Purpose Imaging and measurement of
  • Conducting samples
  • Semi-conducting samples
  • Thin (~ 5 µm <) layers of non-conducting materials such as polymers
Other purpose
  • E-beam lithography using Raith Elphy Quantum system
Location
  • Cleanroom of DTU Nanolab
Performance Resolution
  • ~ 5 nm (limited by vibrations)

The resolution is strongly dependent on the type of sample and the skills of the operator.

Instrument specifics Detectors
  • Secondary electron (Se2)
  • Inlens secondary electron (Inlens)
  • Backscatter electron (BSD)
Stage
  • X, Y: 125 × 100 mm
  • T: 0 to 90o
  • R: 360o
  • Z: 48 mm
Electron source
  • FEG (Field Emission Gun) source
Operating pressures
  • Fixed at High vacuum (2 × 10-5mbar - 10-6mbar)
Options
  • Raith Elphy Quantum E-Beam Litography system
Substrates Batch size
  • Wafers up to 6" (only full view up to 4")
Allowed materials
  • Any standard cleanroom materials.
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