Specific Process Knowledge/Back-end processing/Polishing machine

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Polisher/Lapper

The Logitech PM5 Polisher/Lapper

Training is required before using th machine. The machine is equipped with a LabManager lock.

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

Equipment Polisher/Lapper
Purpose

Thinning of substrates of

  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz
Performance Thinning
  • Removal rate: 1-10µm/min
  • Thickness accuracy: +/- 10 µm
  • Thickness homogeneity: +/- 10 µm
  • Roughness: +/- ? µm
Polishing
  • Removal rate: ~1 µm/min
  • Thickness accuracy: ? µm
  • Thickness homogeneity: ? µm
  • Roughness: +/- ? µm
Process parameter range Polishing liquid
  • Al2O3 (alumina) powder: 3, 9 or 20 µm
  • Chemlox (for polishing)
  • SF1 Polishing Fluid (for polishing e.g. SiO2)
Polishing cloths
  • Chemcloth Polishing Cloths (for use with SF1 liquid)
Rotation speed
  • Thinning: 5-20 rpm
  • Polishing: 5-80 rpm
Arm sweep
  • Thinning: stationary
  • Polishing: 12% (inner) - 80% (outer)
Substrates Batch size
  • # small samples
  • one 50 mm wafer
  • one 100 mm wafer
Allowed materials
  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz