Specific Process Knowledge/Lithography/Coaters/GammaDUV

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Revision as of 15:35, 27 January 2023 by Jehem (talk | contribs) (Created page with "==Spin coater: Süss stepper== 300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system. '''The user manual, quality control procedures and resul...")
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Spin coater: Süss stepper

The SÜSS Spinner-Stepper is placed in F-3

This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager: Equipment info in LabManager

DUV resist overview

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.


Bottom Anti Reflection Coating (BARC):


Positive DUV resist for spin coating in 600-300nm thickness range:


Positive DUV resist for spin coating in 1600-800nm thickness range:


Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:

Quality Control (QC)

Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6
QC Recipe: (1201) DCH 150mm BARC 65nm
Substrate size 6"
Resist volume 3 ml
Spin-off speed 4700 rpm
Spin-off time 30 s
Soft bake temperature 175°C, contact
Soft bake time 60 s
QC limits Spin coater: Süss Stepper - BARC DUV42S-6
Nominal film thickness 65 nm
Film thickness deviation from nominal <15%
Film thickness non-uniformity <5%

Spin-off speed will be adjusted if film thickness is outside the limit.


Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6
QC Recipe: (1202) DCH 100mm BARC 65nm
Substrate size 4"
Resist volume 1.6 ml
Spin-off speed 3000 rpm
Spin-off time 30 s
Soft bake temperature 175°C, contact
Soft bake time 60 s
QC limits Spin coater: Süss Stepper - BARC DUV42S-6
Nominal film thickness 65 nm
Film thickness deviation from nominal <15%
Film thickness non-uniformity <5%

Spin-off speed will be adjusted if film thickness is outside the limit.


Standard processes

BARC DUV42S-6 coating sequences:

  • (1201) DCH 150mm BARC 65nm Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
  • (1202) DCH 100mm BARC 65nm Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C

KRF M230Y coating sequences:

  • (1301) DCH 150mm M230Y 360nm Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
  • (1302) DCH 100mm M230Y 360nm Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C

KRF M35G coating sequences:

  • (1401) DCH 150mm M35G 750nm Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
  • (1402) DCH 100mm M35G 750nm Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
  • (1403) DCH 150mm M35G 1000nm Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
  • (1404) DCH 100mm M35G 1000nm Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
  • (1405) DCH 150mm M35G 1400nm Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
  • (1406) DCH 100mm M35G 1400nm Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C

Equipment performance and process related parameters

Purpose
  • Spin coating and soft baking of BARC
  • Spin coating and soft baking of DUV resists
  • Post exposure baking
Resist
  • BARC DUV42S-6
  • Positive tone resist KRF M230Y
  • Positive tone resist KRF M35G
  • Negative tone resist UVN2300-0.8
Performance Coating thickness
  • BARC DUV42S-6 60-90nm
  • Positive tone resist KRF M230Y 300-600nm
  • Positive tone resist KRF M35G 800-1600nm
  • Negative tone resist UVN2300-0.8 200-1400nm
Process parameters Spin speed

10 - 5000 rpm

Spin acceleration

100 - 10000 rpm/s

Hotplate temperature
  • 175°C for BARC baking
  • 130°C for positive tone resist soft baking and post exposure baking
  • 100°C for negative tone resist soft baking and post exposure baking
Substrates Substrate size
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (requires tool change)
Allowed materials
  • Any standard cleanroom material
Batch

1 - 25


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