Specific Process Knowledge/Lithography/Coaters/labspin

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Manual Spin Coaters


Spin Coater: Labspin 02 Spin Coater: Labspin 03 + fumehood 11 Spin Coater: Manual All Purpose (Decommissioned)
Loacted in wetbench 08 in E-5 Located in wetbench 09 in E-5 Located in fumehood in C-1
LabSpin 6, Süss MicroTec LabSpin 6, Süss MicroTec WS-650, Laurell
LabManager LabManager LabManager


Training video: LabSpin02 + 03

Process information

Spin curves (LabSpin 6): AZ 5214E‎, AZ nLOF 2020, ZEP 520A‎, FOX-15, AZ 4562‎, CSAR 6200, AZ MiR 701.

More information on resists (incl. spin curves) is available in the Resist Overview.


This table is under construction

Available bowlsets:

Component solvent Cleaning solvent List of resists Comments
AZ resist PGMEA/Ethyl Lactate Acetone AZ 5214E, AZ 4562, AZ MiR 701, AZ nLOF 2000 series,

mr-I8100R?

Two sets available
CSAR/ZEP/mrEBL/PMMA Anisole Remover 1165 AR-P 6200 series (CSAR 62), ZEP520A, mr EBL 6000, PMMA (in anisole),

UV5?, mr-T85L?, XNIL26?, mri8000?, mr-I 7010E?, mr-XNIL26_SF?, mrNIL210?

HSQ/AR-N 8200 MIBK/PGMEA Acetone HSQ (FOx series), AR-N 8200
OrmoComp/OrmoStamp Propyl Acetate Acetone OrmoComp, OrmoStamp, OrmoPrime, OrmoClad?

Inkron?, mr-I-7030R?, mr-I 8020E?, mr-I-7010E?, mrNIL210?, mr-I 8500E?, mr-T85?, MRT HI01XP?, Protek B3?, mrUVCur21?, mr-I 8100E_XP?, mrNIL210?, MRT HI01XP?, mr-NIL 6000.3E?, mr-I 8100R_XP?

BCB/CYCLOTENE Mesitylene T1100 3022-X, 4022-X
Epoxy/Acrylate Cyclopentanone/PGMEA Acetone SU-8 2000 series, mr-DWL, LOR (1A, 3A, 5A)

mr-i 8030e?, mr-NIL200?, DELO-PRE/OM4310?, OrmoStamp?, Inkron?, mr-I 8020E?, OM4310?

AR-P 617/AR-N 7520 PGME/PGMEA Acetone AR-N 7500 series
Polymer Ps-b-PDMS/block copolymer Heptane Ethyl Acetate
DIRTY bowlset Anything Organic Use the appropriate cleaning reagent for your resist


Equipment performance and process related parameters

Purpose Labspin

Spin coating of resist ONLY in dedicated bowlsets

Please do NOT use substances which is not for the dedicated bowlsets

All purpose

Spin coating of dirty substances in All purpose

Process parameters Spin speed
  • Vacuum chuck: 100 - 5000 rpm
  • Edge handling chuck: Max. 3000 rpm
Spin acceleration
  • 200 - 4000 rpm/s
Substrates Substrate size
  • Chips 5x5 mm and up
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

All cleanroom materials

Please ONLY use substances which is for the dedicated bowlsets in labspins

Batch

1


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