Specific Process Knowledge/Lithography/Coaters/GammaUV

Spin Coater: Gamma UV

Spin Coater: Gamma UV was installed at DTU Nanolab in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, HMDS vapour priming, and baking modules.

The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".

The coater is equipped with 3 different resists lines:

AZ MiR 701
AZ nLOF 2020
AZ 5214E
Syringe, which can be used for various resists

The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.

Training video

The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager

Process information

General Process Information

Standard Processes:

Syringe processes

Equipment performance and process related parameters

Purpose		HMDS priming Spin coating of PGMEA based UV resists Spin coating of E-beam resists ¹⁾ Soft baking
Resist		AZ MiR 701 (29cps) AZ nLOF 2020 AZ 5214E 60cc syringe dispense
Performance	HMDS contact angle	60 - 80°
Performance	Coating thickness	AZ MiR 701: 1.5-4 µm AZ nLOF 2020: 1.5-5 µm AZ 5214E: 1.5-5 µm AZ 4562: 5-15 µm
Process parameters	Priming temperature	120 °C
	Spin speed	10 - 6000 rpm
	Spin acceleration	10 - 10000 rpm/s
	Hotplate temperature	25 - 200 °C
	Cool plate temperature	21 °C
Substrates	Substrate size	50 mm wafers ¹⁾ 100 mm wafers 150 mm wafers 200 mm wafers ¹⁾
	Allowed materials	Silicon and glass No resist or crystalbond allowed in the HMDS module
	Batch	1 - 25

¹⁾ Requires tool change.