Specific Process Knowledge/Lithography/Resist/DUVresist

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Revision as of 15:06, 26 January 2023 by Jehem (talk | contribs) (Created page with "'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Resist/DUVresist click here]''' ==DUV resist== The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. In...")
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DUV resist

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.

Information about resist can be found here:

  • Bottom Anti Reflection Coating (BARC) DUV 42S-6 Datasheet DUV42S-6.
  • Positive DUV resist for spin coating in 600-300nm thickness range KRF M230Y.
  • Positive DUV resist for spin coating in 1600-800nm thickness range KRF M35G.
  • Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range UVN2300-0.8.
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