Specific Process Knowledge/Thin film deposition/Deposition of Tin

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Tin deposition

Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin.

	E-beam evaporation (Temescal)
General description	E-beam deposition of Sn (line-of-sight deposition)
Pre-clean	Ar ion clean
Layer thickness	10Å to 1µm*
Deposition rate	1Å/s to 10Å/s
Pre-clean	Ar ion bombardment
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) small pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet
Comment	Tin has not yet been deposited in the Temescal to date (May 2022). Please contact the Thin Film group if you would like us to develop the process.

* For thicknesses above 600 nm permission is required.