Specific Process Knowledge/Lithography/EBeamLithography/eLINE
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Process information for the Raith eLINE Plus system
The system was installed in the cleanroom in May 2022. As we get more familiar with the tool this page will be populated with relevant process information.
Dose information
The eLINE tool operates with four different dose types
- Area dose [µC/cm2],
- Curved element dose [µC/cm2]
- Line dose [pC/cm]
- Dot dose [pC].
Notice how the units are different for the line and dot doses. Also notice that the unit prefix changes from micro to pico. The dose for each type can be setup under the "Patterning Parameter", see image below. Before updating the requested dose the beam current must be measured from the "Patterning Parameter" page. In all tabs the user will set a step size, i.e. the distance between beam positions and a dose. The dwell time must then be updated by clicking the calculate icon next to the dwell time field. The dwell time will be calculated based on the last beam current measurement.
Dot dose, line dose and curved element doses can be disabled in the Patterning Parameter window and in that case the system will only operate with an area dose.
We recommend all EBL users to do a dose test prior to exposing samples of significant value. As a starting point you can consider to use the Demo.csf provided on the tool. This pattern is available in the auto generated user folder. The pattern consist of areas, curved elements, lines and dots as shown below. LINK TO PAGE WITH MORE INFO.
Table of dose to clear on Si substrate:
| Dose [µC/cm2] | |||
|---|---|---|---|
| Acc. voltage | AR-P 6200.09 (180 nm) | PMMA 950k | AR-N 8200.xx |
| 10 kV | 30 | ||
| 20 kV | 70 | ||
| 30 kV | 100 | ||