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Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)

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Revision as of 23:41, 11 January 2022 by Eves (talk | contribs) (Created page with "=Pt Sputtering= This page presents the results of Pt deposition using <b>DC sputtering</b> in Sputter-System Lesker, now commonly known as "Old Lesker". The deposition target...")
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Pt Sputtering

This page presents the results of Pt deposition using DC sputtering in Sputter-System Lesker, now commonly known as "Old Lesker". The deposition target is Pt. Source #2 (DC) was used.

The fabrication and characterization described below were conducted in 2021 by Evgeniy Shkondin, DTU Nanolab. The focus of the study was the deposition conditions.


The process recipe in a Sputter-System (Lesker) is following:


  • Deposition type: DC
  • Power: 250 W.
  • Pressure: 3 mTorr
  • Gas: Ar
  • Deposition time: 60s
  • Temperature: 20°C (no heating)
  • Measured DC bias: 418V


Measured thickness (by XRR) is 22.42 nm


  • Deposition Rate: 0.3737 nm/s


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