Specific Process Knowledge/Bonding/Wafer Bonder 02
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Revision as of 11:01, 30 March 2021 by Rkch (talk | contribs) (→Overview of the performance of the Wafer Bonder 02 and some process related parameters)
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The Wafer bonder 02 is a system for bonding. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces.
The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager: Equipment info in LabManager
Process information
Types of Bonding
Purpose | Bonding |
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---|---|---|
Performance | Alignment accuracy |
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Process parameter range | Process Temperature |
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Process pressure |
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Piston Force |
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Substrates | Batch size |
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Substrate material allowed |
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Material allowed on the substrate |
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