Specific Process Knowledge/Thin film deposition/Sputter deposition of metals and alloys

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Sputter deposition of metals and alloys

Many metals and some alloys are well suited for sputter deposition. Below you can compare the sputter systems available here at Nanolab for depositing them.

This page is a collective page for metals and alloys that we do not deposit by any other methods. Other metals that may be deposited both by sputtering and other methods are described on their own individual metal pages (see the thin film main page).

Metals which have been sputter deposited here at Nanolab and which cannot be deposited here by e-beam or thermal evaporation include:

  • Cobalt
  • Iron

Alloys which may be sputter deposited here at Nanolab include:

  • Al-Cu
  • Co-Fe
  • Cu-Ti
  • Fe-Mn
  • Mn-Ir (deposited several times with the Sputter-System (Lesker), see process log)
  • Nb-Ti (deposited several times with the Sputter-System (Lesker), see process log)
  • Ni-Co
  • Ni-Fe (deposited several times with the Sputter-System (Lesker), see process log)
  • Ni-V (extensively deposited with the Sputter-System (Lesker), see process log, and with the Wordentec, see process log)
  • Ti-W alloy (10%/90% by weight) (extensively deposited with the Sputter-System (Lesker), see process log, and with the Wordentec, see process log)