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Specific Process Knowledge/Back-end processing/LatticeAxe

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Equipment performance and process related parameters

Equipment Wafer scriber
Purpose Scribing of Si wafers for easy breakage into single dies..
Performance Scribe lines Lines can be made perpendicular to each other by turning chuck 90°
Process parameter range Wafer thickness Adjustable by increasing or decreasing the load of the diamond pen
Distance between scribe lines Approx. 5 mm
Substrates Size of Substrate Up to 100 mm wafers
Allowed materials All but only Si where the scribe lines are made



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