Specific Process Knowledge/Thin film deposition/Deposition of Gold

Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Leybold)	E-beam evaporation (Wordentec)	Sputter (Lesker)
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers	24x2" wafers or 6x4" wafers or 6x6" wafers	up to 1x6" wafer
Pre-clean	RF Ar clean	Ar ion bombartment	RF Ar clean	RF Ar clean
Layer thickness	10 Å to 1 µm	10 Å to 1500 Å	10 Å to 1 µm	10 Å to
Deposition rate	2 Å/s to 15 Å/s	1 Å/s to 5 Å/s	1 Å/s to 15 Å/s

Adhesion of Au on Si

Adhesion of Au layers

Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings