Specific Process Knowledge/Thin film deposition/Deposition of Tin

From LabAdviser

Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Leybold)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 8x4" wafers or
  • 5x6" wafers
Pre-clean RF Ar clean Ar ion bombartment
Layer thickness 10Å to 1µm 10Å to 1500Å
Deposition rate 2Å/s to 15Å/s 1Å/s to 5Å/s
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