Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope
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Revision as of 13:09, 17 March 2020 by Jmli (talk | contribs) (→Process optimization using the Picoscope)
Process optimization using the Picoscope
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
Process A parameters | ||
---|---|---|
Step 2 | ||
Parameter | Etch | Dep |
Gas flow (sccm) | SF6 350 (1.5 s) 550 | C4F8 200 |
Cycle time (secs) | 7.0 | 4.0 |
Pressure (mtorr) | 25 (1.5 s) 150 | 25 |
Coil power (W) | 2800 | 2000 |
Platen power (W) | 140 (1.5) 45 | 0 |
Cycles | 44 (vary this) | |
Common | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers |
- 4 cycles of Process A
- 4 cycles of Process D4