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Descum results
Plasma asher 1
Descum results
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer.
Note: Plasma asher was cold before use
| Settings
|
Etched Thickness (nm)
|
|
|
ashing time (min)
|
| Recipe |
O2 flow |
N2 flow |
Power
|
1 |
2 |
5 |
7 |
10 |
10
|
| 1 |
70 |
70 |
150 |
14,2 |
16,3 |
47,6 |
123,2 |
854,3 |
862,1
|
| 2 |
500 |
0 |
200 |
|
8,1 |
32,9 |
271,1 |
495,6 |
446,2
|
Conny Hjort & Jesper Hanberg
September 2019
Plasma asher 2
 Descum results
| Etched Thickness (nm)
|
| ashing time (min)
|
| 1 |
2 |
3 |
4 |
6 |
7 |
8 |
9 |
10 |
12 |
14 |
15 |
-
|
1 |
70 |
70 |
150 |
14,2 |
16,3 |
47,6 |
123,2 |
854,3 |
862,1
|
|
|
