Specific Process Knowledge/Thermal Process/Oxidation/Standard oxidation recipes
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Recipes for dry oxidation
Dry oxidation of silicon wafers can be done in these furnaces:
- A1 Boron Drive-in and Pre-dep
- A2 Gate Oxide
- A3 Phosphorus Drive-in
- C1 Anneal Oxide
- C3 Anneal Bond
- C4 Al-Anneal
The recipes for dry oxidation are very similar on these furnaces.
The oxidation and annealing times are variable commands. It means that these can be changed by the users. The maximum allowed oxidation time is ...
The oxidation temperatures are fixed in the recipes. The temperature can be seen in the recipe name, e.g. "DRY1000" for dry oxidation at 1000 C.
The oxidation furnaces in the cleanroom are being used for dry and wet oxidation of silicon wafers.
Dry oxidation can be done in the these furnaces:
- A1 Boron Drive-in and Pre-dep furnace
- A2 Gate Oxide furnace
- A3 Phosphorus Pre-dep furnace
- C1 Anneal-Oxide furnace
- C3 Anneal-Bond furnace
- Multipurpose Anneal furnace
Wet oxidation can be done in these furnaces:
- A1 Boron Drive-in and Pre-dep furnace
- A3 Phosphorus Pre-dep furnace
- C1 Anneal-Oxide furnace
- C2 III-V Oxidation furnace
- C3 Annea-Bond furnace
On this page the steps in the standard oxidation recipes on the furnaces will be listet.
Dry oxidation of III-V samples can be done in the C2 III-V Oxidation furnace, more information can be found here:
Dry oxidation of silicon and other materials can be done in the Multipurpose Anneal furnace and the Noble furnace, but there are not really any standard recipes on these furnaces.
Dry oxidation recipe steps
0 STANDBY Message: "Standby"
The furnace is
Temperature: 700 C
N2 flow: 3 SLM
Furnace closed
The user has to press "Start" (on the touch screen or furnace computer) to start the recipe.
It a dry oxidation recipe is aborted, it will jump to the "Standby" step.
- LM-LOCK
Message: "Standby" The recipe can only continue, if a user is logged on in LabManager
- OPEN
Message: "Boat moving" The furnace opens
- LOAD WAFERS
Message: "Load wafers Wafers are loaded in furnace.
The user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace
- CLOSE
Message: "Boat moving" The furnace is closing
- HEAT UP
Message: "Heat-up" The furnace is heating up to the temperature defined in the recipe The recipe will continue to the next step, when the temperature of center heating zone (zone 2) reached the right temperature
- OXIDATION
Message: "Dry oxidation"
The dry oxidation is started O2 flow: 5 SLM N2 flow: 0 SLM
The oxidation time is a variable command.
has been defined by the user. The oxidation time can be changed, until the oxidation step is started.
- ANNEAL
Message: "Anneals/Dens"
- COOL DOWN
Message: "Cool-down"
The furnace is cooling down to 700 C (the standby temperature)
- UNLOAD WAFERS
Message: "Unload wafers"
The user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace
- OPEN
Message: "Open"
The furnace opens.
- UNLOAD
Message: "Unload wafers"
When the furnace is open, the wafer can be unloaded. Be aware of, that the wafers are very hot, so they have to cool down for about five minutes
When the wafers are unloaded, the user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace. The recipe then jumps to the STANDBY step, and the user can leave the furnace, after it has closed.
If a recipe is aborted
The standard annealing time is 20 minutes, but users can change the time. The annealing time can be changed, until the annealing step is started.