Specific Process Knowledge/Characterization

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Overview of characteristics and where to measure it

Optical Micro- scopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflec- tometer) Ellip- someter Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester DSC Perkin Elmer
Thin film thickness x 1) x 1) x 2) x 2) x x x x 5) x 3) x
Defects x x
Wafer thickness x 1) x 1) x
Step coverage x 1) x 1)
Particles x x x
Element analysis x x x 4) x 4)
Surface roughness x x x
Deposition uniformity x x x
Film stress x x
Refractive index x x
Reflectivity x x (x)
Resistivity x
Breakdown voltage
Electrical conductivity x
Thermal conductivity
Optical gap x x
Crystalinity x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Material Hardness x
Voids in wafer bonding x
  1. Using the cross section method
  2. Using the create step method
  3. With known resistivity
  4. Composition information for crystalline materials
  5. Only single layer

Choose characterization topic

Choose equipment

AFM

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization


SEM's at CEN

SEM's at Danchip

TEM's at CEN

Various