Specific Process Knowledge/Characterization/Hardness measurement

Feedback to this page: click here

Thickness measurer

Thickness Measurer. Positioned in cleanroom D-3

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. The QC procedure The newest QC data

Equipment performance and process related parameters

Purpose	Hardness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Substrates	Batch size	One sample
	Substrate materials allowed	No restrictions