Specific Process Knowledge/Bonding/Imprinter 02

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The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds bonding can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces.

The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager: Equipment info in LabManager

Overview of the performance of the Imprinter 02 and some process related parameters

Purpose	Bonding	PMMA bonding SU-8 bonding BCB bonding
Performance	Alignment accuracy	Flat alingment by eye
Process parameter range	Process Temperature	Room temperature to 240${\rm {^{o}}}$C
	Process pressure	~1mbar - 1000mbar
	Piston Force	Atm - 6000 mbar.
Substrates	Batch size	One wafer per run Pieces
	Substrate material allowed	Silicon wafers Quartz wafers Pyrex wafers InP GaAs
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Poly Silicon PMMA SU-8 BCB Metals: Au, Sn, Ag, Al, Ti.